12/15/18W UV Laser Laser PCB Depanel with High Cutting Precision Laser PCB Depanel Features
1. Neat and smooth edge, no burr or overflow
2. More quick and easy, shorten the delivery time
3. High quality ,no distortion,surface clean& uniformity;
4. Gathering the CNC tech,laser tech,software tech…High accuracy,High speed
Laser PCB Depanel Parameter
| Parameter | ||
|
Technical parameters |
Main body of laser | 1480mm*1360mm*1412 mm |
| Weight of machine | 1500Kg | |
| Power | AC220 V | |
| Laser | 355 nm | |
| Laser |
Optowave 10W(US) |
|
| Material | ≤1.2 mm | |
| Precisio | ±20 μm | |
| Platfor | ±2 μm | |
| Platform | ±2 μm | |
| Working area | 600*450 mm | |
| Maximum | 3 KW | |
| Vibrating | CTI(US) | |
| Power | AC220 V | |
| Diameter | 20±5 μm | |
| Ambient | 20±2 ℃ | |
| Ambient | ＜60 % | |
| The Machine | Marble | |
Laser PCB Depanel Advantages
High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.
Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;
Reduce energy consumption, Cost savings.
Cost-effective, fast cutting speed, stable performance
Laser PCB Depanel Application
FPC and some relative materials;
FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.
Laser PCB Depanel Details
